Study on the shear strength of joints between the Sn95Sb5 solder and annealed Ni-P electroless-plated Cu substrate
碩士 === 中興大學 === 材料科學與工程學系所 === 98 === In this research, it would be studied about the strength of solder joint which connected Sn-5wt%Sb alloy and Cu/Ni-P substrate annealed under different condition. The annealing temperature of Al2O3/Cu/Ni-P substrates are 300 and 350℃ separately together with ann...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11191685058744575168 |