Force and Vibration Analysis of Crank-Rocker Pick and Place Mechanism

• Main Author: 黃英德
• Other Authors: Hsing-Hsin Huang
• Format: Others
• Language: en_US
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/96832190528433405904

碩士 === 明新科技大學 === 精密機電工程研究所 === 99 === High speed is an important issue in the semiconductor processing equipment. As usual, the chip needed to be transferred frequently in the semiconductor back-end processing. In recent years, the Pick & Place Machine (PPM) has been widely applied to automation equipments and press fabrication industries, especially in semiconductor IC packaging process because it could satisfy the requirements. Die bonding is a very important process of IC packaging. The quality of IC packaging depends on the speed, accuracy, and precision of the pick and place process. Therefore, a pick and place device is always necessary to hit the target of accurate transmission at the shortest time. One of the most important and common mechanisms is the crank-rocker. It is found in pumps, compressors, steam engines, feeders, crushers, etc. Specially, It is very useful to perform the function of pick and place used in die-bonding system in semiconductor fabrication. In this research, the author has cooperated with the professional IC package equipment manufacturer, 3S Silicon Tech., Inc. The purpose of this research is to propose a mechanical design, kinematic, dynamic analysis and measure the vibration for a crank-rocker pick and place mechanism (PPM), which is applied to a die-bonding system.