Analysis of PCB Bonder Machine

• Main Authors: Nguyen Minh Ngoc, 阮明玉
• Other Authors: Fu-Hua Jen
• Format: Others
• Language: en_US
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/56343539439454779109

碩士 === 明新科技大學 === 精密機電產業研發碩士外國學生專班 === 98 === The main objective of this study is to analyze the rigidity of bonder machine in Printed Circuit Board (PCB) process. PCB process is one of steps in Thin Film Transistor Liquid Crystal Display (TFT-LCD) manufactory process that includes 7 steps. The PCB is used to mechanically support and electrically connect components with conductive pathways. Analyzing the stucture of machine is an indispensable step in the design process of a machine. This research analyzed two major parts of the bonding machine by using ANSYS Workbench. The ANSYS Workbench is used in this research to execute solid modeling, simulation of structural and thermal analysis of bonding machine. ANSYS Workbench is the foremost among application software of this type in capability, flexibility, and easy to use. When working on engineering design or manufacturing machine, the geometry can be created by CAD software such as Inventor, Solidwork, Catia and imported into ANSYS Workbench without any difference. In the first part of this research, the static analysis of the frame under loading is carried out and some results as normal stress, deformation, total deformation, strain were inspected. The results of the analysis show maximum von Mises stress meet the criterium and remain in safety. However, an improved design of the machine can reduce material but keep structure in safety. The second part of the research is focus on the thermal analysis of heating bar of the machine. The results show temperature distribution. Thermal stress are inspected for further improvement on design. Several improved designs of heating bar are analyzed and results are compared to provide useful imformation to manufactures.