Numerical Simulation Analysis of Heat Transfer and Thermal Stress for the High Power Light Emitting Diode Micro Package Design
碩士 === 明新科技大學 === 精密機電工程研究所 === 98 === The study aim at the heat transfer and thermal stress analysis of the micro packaging structure of high power Light Emitting Diode (LED) have been performed. The silicon substrate material of LED micro structure system the research method of design and analysis...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46099424375962613206 |