The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating
碩士 === 明新科技大學 === 化學工程與材料科技系 === 99 === In this research,conductive polyimide films were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The discussion Poly(vinyl pyrrolidone) (PVP) and potassium iodide two kinds of additives analyze to the electroless c...
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2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43515137716039708964 |
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ndltd-TW-098MHIT50630272015-10-14T04:07:02Z http://ndltd.ncl.edu.tw/handle/43515137716039708964 The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating 聚乙烯吡咯酮添加劑對聚醯亞胺薄膜化學析鍍銅的影響 劉一德 碩士 明新科技大學 化學工程與材料科技系 99 In this research,conductive polyimide films were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The discussion Poly(vinyl pyrrolidone) (PVP) and potassium iodide two kinds of additives analyze to the electroless copper plating influence on the plating rate,surface morphology,crystal and resistivity of copper deposition. The surface of these films treated with additives exhibited low resistivity and excellent conductivity. These films were investigated by the X-ray to analysis crystallization change and by using four-point probe to analysis electric properties. There has another purpose in this study that is applied to electromagnetic interference (EMI) shielding materials for electroless copper plating, 顏志超 2011 學位論文 ; thesis 69 zh-TW |
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NDLTD |
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zh-TW |
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Others
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NDLTD |
| description |
碩士 === 明新科技大學 === 化學工程與材料科技系 === 99 === In this research,conductive polyimide films were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The discussion Poly(vinyl pyrrolidone) (PVP) and potassium iodide two kinds of additives analyze to the electroless copper plating influence on the plating rate,surface morphology,crystal and resistivity of copper deposition. The surface of these films treated with additives exhibited low resistivity and excellent conductivity. These films were investigated by the X-ray to analysis crystallization change and by using four-point probe to analysis electric properties. There has another purpose in this study that is applied to electromagnetic interference (EMI) shielding materials for electroless copper plating,
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| author2 |
顏志超 |
| author_facet |
顏志超 劉一德 |
| author |
劉一德 |
| spellingShingle |
劉一德 The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating |
| author_sort |
劉一德 |
| title |
The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating |
| title_short |
The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating |
| title_full |
The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating |
| title_fullStr |
The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating |
| title_full_unstemmed |
The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating |
| title_sort |
effects of poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating |
| publishDate |
2011 |
| url |
http://ndltd.ncl.edu.tw/handle/43515137716039708964 |
| work_keys_str_mv |
AT liúyīdé theeffectsofpolyvinylpyrrolidoneadditiveonpolyimideforelectrolesscopperplating AT liúyīdé jùyǐxībǐgētóngtiānjiājìduìjùxīyàànbáomóhuàxuéxīdùtóngdeyǐngxiǎng AT liúyīdé effectsofpolyvinylpyrrolidoneadditiveonpolyimideforelectrolesscopperplating |
| _version_ |
1718089770285924352 |