The effects of Poly(vinyl pyrrolidone) additive on polyimide for electroless copper plating
碩士 === 明新科技大學 === 化學工程與材料科技系 === 99 === In this research,conductive polyimide films were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The discussion Poly(vinyl pyrrolidone) (PVP) and potassium iodide two kinds of additives analyze to the electroless c...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43515137716039708964 |
| Summary: | 碩士 === 明新科技大學 === 化學工程與材料科技系 === 99 === In this research,conductive polyimide films were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The discussion Poly(vinyl pyrrolidone) (PVP) and potassium iodide two kinds of additives analyze to the electroless copper plating influence on the plating rate,surface morphology,crystal and resistivity of copper deposition. The surface of these films treated with additives exhibited low resistivity and excellent conductivity. These films were investigated by the X-ray to analysis crystallization change and by using four-point probe to analysis electric properties. There has another purpose in this study that is applied to electromagnetic interference (EMI) shielding materials for electroless copper plating,
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