A Study of the Optimization of the Forming Stress of the IC Outer Leads for Semiconductor Packaging
碩士 === 國立高雄應用科技大學 === 模具工程系 === 98 === In recent years, the environmental production process was introduced into the semiconductor packaging industry. Alternatively, all its materials were environmental. The new process conditions and parameters resulted from the new environmental materials, the con...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16789468888019272807 |