| Summary: | 碩士 === 遠東科技大學 === 機械工程研究所 === 98 === Abstract
As time progresses with the growth of modern technology, the fast development of electronic components is accompanied by the high heat generation. For example, the applications of the heat sink considered in this paper are mainly to lower and maintain the temperature of the CPU. However, the newly developed CPUs still remain 70~130W as their maximum power. The CPU chip thus will be prone to aging or even damage if the temperature is not well controlled. Other factors such as the internal space and the air inlet/outlet post harsher challenger to the efficiency of design and improvement of heat sinks.
This research aims at the improvement of the performance of the CPU heat sinks. In the course of the study, coverall software is used to carry out numerical simulations. Taguchi robust design is also used to determine the optimal design parameters such as heat transfer areas of the fin, internal flow field of the heat sink, and the boundary layer of the fin. The optimal parameters are confirmed with the numerical simulation results to achieve the enhancement of the heat sink performance. Finally, real models based on the optimal parameters are manufactured for experimental measurement. The numerical results are verified by the experimental measurement to assure the accuracy.
The results of this study show that the optimal parameters enhance the heat sink performance effectively. The optimal parameters are the width of the gap being 1.5mm, internal diameter 35mm, the number of the gap being 2, the depth of the gap 4mm, and the inclined angle 35°. The performance is increased by 7.16%, and mutual authentication through experimental and numerical maximum error after the 5.59%.
Keywords: thermal module, Taguchi robust method, heat sink, heat transfer enhancement
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