Analyze the optimum parameters of minimum warpage of injection molding mobile phone back cover by Taguchi method

• Main Authors: Ping-Cheng Lin, 林秉正
• Other Authors: none
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/49689259208683369407

碩士 === 逢甲大學 === 材料與製造工程所 === 98 === Owning to development of technology and popularization of mobile 3C product, designs of 3C product in market are tending to thin, small and light. Parts of these products are developed to reduce weight and thickness. Most plastic parts are molded by injection molding. There are flow jam, residual stress and warp issues at thin zone of plastic parts. Therefore, the technology of injection thin plastic part is a very important technology. In this study, Polycarbonate was used to simulate injection mobile phone back cover by Moldflow software. The effects of plastic temperature, injection pressure, packing pressure and cooling time for warp of mobile phone back cover. The experiments obtain optimum molding parameters with Taguchi method. The simulated result shows that packing pressure and injection pressure are most effective factor that cause product warp. Optimum parameter can improve 38.06% warp than original parameter. Besides, the strength of weld line of optimum is higher than original.