The Study of Yield Improvement of Semiconductor Manufacturing Process
碩士 === 中原大學 === 電子工程研究所 === 98 === The purpose of this study is to investigate defects of semiconductor backend process equipment. The backend defect can be divided into three parts, including material defects and process or equipment issue which result in the defects. The process or equipment issue...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59692467681340544756 |