Strength Analysis of Ultra-Thin Wafers by Three-Point Bending Test and Thin Wafer Probe Testing Method with Temperature Effect
碩士 === 國立中正大學 === 機械工程所 === 98 === Light weight, small size, low voltage, and low cost are the mainly request of high performance IC product; on the other hand, it also means the spacing for IC system is very limited. Therefore newly development of 3D Stacked-Die Packaging (SDP) is the current impor...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/33759417392956658046 |