| Summary: | 碩士 === 國防大學理工學院 === 機械工程碩士班 === 98 === The purpose of this study is to establish a manufacturing processes of complex wick and successfully applied to the loop heat pipe (LHP). In order to improve the structural vulnerability and lack of capillary force of a complex wick, and design of a complex wick. To combine two structure into a complex wick, the outer layer is using the biporous wick and the inner layer is using monoporous wick. Therefore, the advantages of the outer layer of complex wick has big pore size of biporous wick can discharge vapor successfully and the inner layer has small pore size can increase the overall structural strength, and can provide high capillary force. Thus, the complex wick retain the advantages of a biporous wick and improve the disadvantages of biporous wick.
In the manufacturing processes, the outer layer of manufacturing parameters of pore former content at fixed 80%, merely to control the particle size of pore former (177-210mm, 210-250mm, 250-297mm and 297-350mm), and to investigate the effect of various the particle size of pore former for a LHP.
The actual of a complex wick into the LHP for heat transport capability tests, and found that the better performance of the smaller of the particle size of pore former range. At the sink temperature of 10℃ and the allowable evaporator temperature of 85℃, the 177-210mm of the particle size of pore former, the maximum heat transfer capacity was up to 700W, and the minimum total thermal resistance was 0.08℃/W.
The best heat transfer capacity experiment results showed that: at the sink temperature of 10℃ and the allowable evaporator temperature of 85℃, the maximum heat transfer capacity was up to 700W, and the minimum total thermal resistance was 0.08℃/W of the complex wick, comparing to a monoporous wick of the maximum heat transfer capacity enhance approximately (420W) 67％, and the minimum total thermal resistance lower approximately (0.12℃/W) 100％, and comparing to a biporous wick of the maximum heat transfer capacity enhance aproximately(620W) 15％, and the minimum total thermal resistance lower approximately (0.12℃/W) 50％.
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