Improving the Electrical Properties of Probe Tip Using Gold Recoating
碩士 === 元智大學 === 電機工程學系 === 97 === During the electrical testing in semiconductor packages, the probe and ball grid array carrier play the key role to bridge between load board and integrated circuit components where the pogo-pin serves as the media for signal transmission and electrical measurement....
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71823104429452102903 |