Context-aware Redundant Via Insertion

碩士 === 元智大學 === 資訊工程學系 === 97 === Post-routing redundant via insertion (RVI) is an effective approach to forming double vias in a chip and effective algorithms have been invented for it. However, implementations of these algorithms often ignore some practical issues and hence constantly report excee...

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Main Authors: Po-Heng Chu, 朱柏衡
Other Authors: Rung-Bin Lin
Format: Others
Language:en_US
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/76796517174113288647
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spelling ndltd-TW-097YZU053920042016-05-04T04:17:08Z http://ndltd.ncl.edu.tw/handle/76796517174113288647 Context-aware Redundant Via Insertion 依情境內容嵌入額外鑽孔 Po-Heng Chu 朱柏衡 碩士 元智大學 資訊工程學系 97 Post-routing redundant via insertion (RVI) is an effective approach to forming double vias in a chip and effective algorithms have been invented for it. However, implementations of these algorithms often ignore some practical issues and hence constantly report exceedingly high RVI rates that are not achievable when these practical issues are considered. In this thesis, we implement a post-routing RVI algorithm that takes into account interconnect contexts during RVI. We especially focus on forming redundant vias at pin ports normally situated at metal layer 1. We also carry out reliability-driven RVI to increase RVI rates on timing critical paths. Our implementation has been ported to a commercial design flow and tested on benchmark circuits synthesized with a commercial standard cell library. Experimental results show that our context-aware RVI on average raises via1 (vias between metal layer 1 and 2) insertion rate from 37.4% to 72.1% and total insertion rate from 72.5% to 85.8%. On average, it increases RVI rate of critical paths by 3.6%. Besides, with redundant pin-area minimization, our approach reduces metal 1 and metal 2 area used for RVI at pins by 3%. Rung-Bin Lin 林榮彬 2009 學位論文 ; thesis 36 en_US
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description 碩士 === 元智大學 === 資訊工程學系 === 97 === Post-routing redundant via insertion (RVI) is an effective approach to forming double vias in a chip and effective algorithms have been invented for it. However, implementations of these algorithms often ignore some practical issues and hence constantly report exceedingly high RVI rates that are not achievable when these practical issues are considered. In this thesis, we implement a post-routing RVI algorithm that takes into account interconnect contexts during RVI. We especially focus on forming redundant vias at pin ports normally situated at metal layer 1. We also carry out reliability-driven RVI to increase RVI rates on timing critical paths. Our implementation has been ported to a commercial design flow and tested on benchmark circuits synthesized with a commercial standard cell library. Experimental results show that our context-aware RVI on average raises via1 (vias between metal layer 1 and 2) insertion rate from 37.4% to 72.1% and total insertion rate from 72.5% to 85.8%. On average, it increases RVI rate of critical paths by 3.6%. Besides, with redundant pin-area minimization, our approach reduces metal 1 and metal 2 area used for RVI at pins by 3%.
author2 Rung-Bin Lin
author_facet Rung-Bin Lin
Po-Heng Chu
朱柏衡
author Po-Heng Chu
朱柏衡
spellingShingle Po-Heng Chu
朱柏衡
Context-aware Redundant Via Insertion
author_sort Po-Heng Chu
title Context-aware Redundant Via Insertion
title_short Context-aware Redundant Via Insertion
title_full Context-aware Redundant Via Insertion
title_fullStr Context-aware Redundant Via Insertion
title_full_unstemmed Context-aware Redundant Via Insertion
title_sort context-aware redundant via insertion
publishDate 2009
url http://ndltd.ncl.edu.tw/handle/76796517174113288647
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