| Summary: | 碩士 === 元智大學 === 化學工程與材料科學學系 === 97 === In this text, The characteristic of the conductive particles module would be studied and trying to make much improvement for the technology of the LCD module COF package. The final goal is reducing the cost and increasing the reliability.
The discussion of the key process is use by quality control analysis methods in this text. We know the bonding Temperature (T), Pressure (P) and bonding time (t) would be the importable of the conductive particle module process. We can get the results from cause analysis as following: (1) IC shift (2) Poor bonding of cell (3) metal particles (4) PWB shift (5) poor bonding of PWB. All above mention is much concerned with the quality of LCD. The effect of the COF package process problem is punch, IC warpage, pressure mechanism parallelism and the dimension (length, thickness) of the PWB. Furthermore, we can find the best level combination of the process parameter. We Compared with improvement around, the defect rate is reduce 7％to 1％.
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