Uniform Parallel-Machine Scheduling Problems with Downward Compatible Machines — a Case Study of A Company
碩士 === 元智大學 === 工業工程與管理學系 === 97 === In the lead frame packaging process of semiconductor manufacturing, wire bond process is the bottleneck operation. Firms constantly seek for new wire bond machines with better functionality and higher efficiency. As a result, a wire bond work center usually conta...
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| Format: | Others |
| Language: | zh-TW |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11212568361185828844 |
| Summary: | 碩士 === 元智大學 === 工業工程與管理學系 === 97 === In the lead frame packaging process of semiconductor manufacturing, wire bond process is the bottleneck operation. Firms constantly seek for new wire bond machines with better functionality and higher efficiency. As a result, a wire bond work center usually contains many machines where old machines are only able to process certain types of products while new machines can process new types as well as old types of products. In addition, new machines can process old products with higher degrees of efficiency. The assignment and sequencing of jobs to wire bond machines can be described as the uniform parallel-machine scheduling problem with downward compatible machines.
This research applies Simulated Annealing algorithm to the considered scheduling problem with the objective of minimizing total completion time. Numerical experiment containing a variety of test problems with data collected from the case company is conducted. It is shown that the proposed algorithm is able to provide quality solutions within reasonable run time.
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