The analysis in Semiconductor Industry to decrease the emission of Perfluorinated Carbons Gas for the stabilization of Green House Effect

• Main Authors: Ming-wei Lin, 林明緯
• Other Authors: Chu-Chin Hsieh
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/20404501312055042349

碩士 === 國立雲林科技大學 === 環境與安全工程系碩士班 === 97 === Owing to the fact that the government policy advanced traditional industry to semiconductor and electro-optical industry, Taiwan became Green Silicon Valley and enhanced the foreign exchange reserve and GDP. With the rapid development of semiconductor industry, Taiwan had significant economic growth, but it resulted in the environmental pollution. It is inevitable to use and emit numerous chemical substances due to the complex and tremendous machines during the production process. Kyoto Protocol which is a a legally binding international agreement entered into force on 16 Febuary 2005 and established the environmental standard of Green House Gas (GHG) emission. It cannot be neglected that the CVD and Dry Etch of production process in semiconductor industry may use GHG including CF4, C2F6, C3F8, C4F8, CHF3, SF6 and NF3, though the emission of these substance is lower than other industries. The report is to concentrate on the decrease of GHG with a semiconductor company and acquire a feasible and practicable method to lower the emission of fluoride. In chapter 3, the company checked the emission of GHG to achieve 2010’s goal. According to the company, the emission of GHG is mostly from 200 mm area and it also showed that the CVD machine dominated 74% of GHG’s emission and the ETCH machine had 26%. As a result, the CVD machine would be the key issue to the goal of achieving decrease of GHG in the atmosphere at a level that would prevent dangerous anthropogenic interference with the climate system. Moreover, the utilization of Machine (Ci), PFC in the transformation ratio of CF4 (Bi) and the reduction ratio of Ai is higher than the default values of the World Semiconductor Committee (WSC) Tier 2c. Therefore, it can be precisely calculated the emission of GHG via changing the equation from Tier 2c to Tier 2b and detecting the production of PFC in the company. Per Tier 2b, the emission of Green House Gas is 0.733 MMTCE which is lower 17% of GHG’s emission (0.607 MMTCE). Not only is the lower emission, but also the disposition of equiptment and machines can be approximately reduced 350 units and it means NTD 1.4 billion in costdown. To optimize the production and substitution of gas can be use to verify the parameter of production, increase the utilization of Perfluorinated Carbons (PFC) and redeuce the GHG’s emission. To assemble PFC Local scrubber would be the best strategy to achieve the goal of Taiwan Semiconductoe Industrial Association (TSIA) 2010. In order to minimize the GHG’s emission with the lowest cost, the vast emission machine has to be improved. To find the suitable and spacious location for setting up PFC Local scrubber via moving the machine and amending the circuit would be the key issue due to the restricted area. If the quantity of PFC Local scrubber to set up on the major emission machine was reduced 1 unit, it has to set up more than 2 units on the minor emission mache in order to have the same result. Accrodingly, the cost would be times more than it.