| Summary: | 碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 97 === The LED is important producs in Taiwan, that have over 25% production in the global, and the High brightness LED production have 72% in this fild on 2008 year. The LED could use by car、cell-phone、LCD、Note Book etc. for back-light to use and a streetlight、desk lamp、fluorescent lamps、flashlight etc. for device of a illumination. It was low power consumption、high efficiency and long Life time of the character. When you need the light source, LED will make selection for you.
The research was made by applying Nd:YAG laser 2nd (λ= 532nm) Combining the machinery type complex process technology .The substrate with high reflection surface that make difficult to do Laser ablation, and the Heat Area Zone (HAZ) will reduce efficiency of the product.
This research uses a machinery type to groove the substrate that free of optics characteristic, combining Laser ablation that with high material remove rate etc. In order to overcome the problem of Laser processes with high reflecting rate surface substrate.
The high reflection surface was be remove and groove the substrate as a machinery type lead away to through a substrate, It was enhance the efficiency for the Laser ablation.
The Laser ablation for substrate with high reflection surface will increase the laser shot. We use machinery type to groove the substrate before Laser ablation, it is reduce the Laser shot and the no ablation heat effect to surface layer, there should be quality processed to keep.
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