Active Soldering of Dissimilar Alloys

• Main Authors: Fu-ming Chang, 張福明
• Other Authors: Shih-ying Chang
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/83077835789945005117

碩士 === 雲林科技大學 === 機械工程系碩士班 === 97 === In the study, the Sn-3.5Ag metal fillers with the addition of trace of mixed rare earth elements and active element Ti, without the use of fiux or in any protection atmosphere, were used for joining the 6061 aluminum alloy/ AZ31 magnesium alloy and 6061 aluminum alloy/ copper. The isothermal aging tests at 150℃ and varying contents of Ti were used to evaluate the interfacial reactions of the joins. Using the Sn-3.5Ag-2Ti-0.1Mm or Sn-3.5Ag-4Ti-0.1Mm filler metals to join the 6061 aluminum alloy with copper without aging treatments or after aging 100 hours tests at 150℃, a layer of Cu-Sn intermetallic compounds was formed at the copper/ filler metal interfaces. The results of the shear tests showed the contents of Ti in filler metals have no obvious influence on the joining strengths of the aluminum alloy/ magnesium alloy and aluminum alloy/ copper joints. Using both Sn-3.5Ag-2Ti-0.1Mm and Sn-3.5Ag-4Ti-0.1Mm filler metals, the shear strengths of aluminum alloy/ magnesium alloy joints higher than that of aluminum alloy/ copper joints were obtained due to the forming of the brittle intermetallic compounds at the interfaces of copper and filler metals.