The peel strength of copper-bonded alumina substrates prepared by physical and chemical oxidation method
碩士 === 大同大學 === 材料工程學系(所) === 97 === Diffusion bonded Cu/Al2O3 substrates were prepared by having pre-oxidized copper foil physically and chemically and then bonding with an alumina under flowing nitrogen atmosphere at 1072oC for various durations. The bond strength between copper and alumina would...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/62689648022491650823 |