The peel strength of copper-bonded alumina substrates prepared by physical and chemical oxidation method

• Main Authors: Keng-cheng Lu, 呂耿成
• Other Authors: She-huang Wu
• Format: Others
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/62689648022491650823

碩士 === 大同大學 === 材料工程學系(所) === 97 === Diffusion bonded Cu/Al2O3 substrates were prepared by having pre-oxidized copper foil physically and chemically and then bonding with an alumina under flowing nitrogen atmosphere at 1072oC for various durations. The bond strength between copper and alumina would be tested by peel test. The relationship among peel strength, degree of pre-oxidation, and duration of diffusion bonding were studied. The reasons of these trends were reveal from the microstructures of the fracture surface on copper and alumina sides by XRD, EDS, and SEM. It is found that the fracture is occurred in the oxide layer during peel test. The thicker the oxide layer on the copper foil for bonding, the lower the peel strength will obtain for the boned substrate. That maybe attributed to the unbonded regions increase with increasing degree of pre-oxidation of copper foil.