Fabrication of Nano-crystalline Silicon Thin Film on Flexible Substrate by Vacuum Arc Discharge.

• Main Authors: Tsung-ying Lin, 林宗穎
• Other Authors: Jeff Tsung-Hui Tsai
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/57707674210668756004

碩士 === 大同大學 === 光電工程研究所 === 97 === Nano-crystalline silicon has been deposited on glass and plastic substrates by direct vacuum arc system at room to cryogenic temperature(77 K). Solid silicon wafer source were amount on both anode and cathode to be the electrodes which were highly doped single crystal silicon wafer(0.005 Ω/cm). It is suitable for deposited thin films on flexible substrate due to low deposition temperature. Silicon films were characterized by Raman spectroscopy、x-ray diffraction (XRD)、tunneling electron microscope (TEM) and scanning electron microscope (SEM). The result revealed that the crystalline structure embedded in amorphous matrix. High-resolution transmission electron microscopy (HRTEM) was used for direct analyzing the particle where the fully crystallized structure were inert the particles and these particles were random distributed over the substrate. The crystalline volume fraction were calculated from Raman spectrum and it showed the values between 0~92 ％. The impurity concentration was measured by SIMS, that the P-type and N-type impurity was permeated simultaneously into the film during the deposition without additional doping process, thus P-N junction could be achieved. Nano-crystalline silicon has higher electron mobility and more stability against prolong light exposure than amorphous silicon. According to our research, the opto-electronic effect were not obviously, we assume that a large number of defects existed in the films. Compared to CVD process, arc discharge system has the advantages of low cost, less environment pollution and non-dangerous of processing. Such research has not yet been observed. Low temperature deposited nano-crystalline silicon thin film has attracted much attention due to applicable on low-cost substrates, like glass and flexible plastic substrate. Key words: Direct vacuum arc, Flexible substrate, crystalline volume fraction.