| Summary: | 碩士 === 國立臺北科技大學 === 機電整合研究所 === 97 === In this study, we utilizing electroless nickel immersion gold to fabricate Carbon nanotube electroncic device combined with standard CMOS process. In this thesis, we will discuss the properties and fabrication of carbon nanotubes electronic devices on a CMOS chips. This research utilizes all kinds of techniques to reach purposes, such as, low temperature fabrication, print pin, electroless nickel immersion gold, and surface modification by self-assembled monolayer (SAM). In the experimental process, the SWCNTs-based electronic devices microstructures are fabricated by standard CMOS process and wet etching process (post-process), and finally deposited and aligned CNTs on the predefined electrode pairs by print pin to complete SWCNTs-based electronic devices fabrication. After utilizing the electroless plating to replace the low work function of Al electrodes (~4.28eV) with the high work function of Ni/Au electrodes (~5.1eV), the formation of an improved metal-CNT contact and reducing the probabilities of surface oxidation resulted in improving performance of the CNT devices and also can have current promoted more than 1000 times. Finally, our ultimate goal, chemical and bio sensed, relies on the CNTFETs technology combined with CMOS circuitry which will be implemented initially, to ensure the feasibility of this novel idea and to propose promising ideas.
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