| Summary: | 碩士 === 國立臺灣科技大學 === 機械工程系 === 97 === As LCD factory advances to the 8.5 generation, the improvement on the manufacture facilities has draw significant attention for enhancing the competition advantage. However, the drying process, which is needed several times during the manufacturing procedure, is becoming more difficult due to the increasing LCD size. Therefore, designing annealing oven (ANOV) for drying LCD substrate is an essential and challenging task for TFT-LCD industry and become the goal of this study. At first, the flow visualization is performed numerically via CFD code Fluent to identify the detailed flow patterns inside the original ANOV. It follows that a severe non-uniform velocity distribution along the different rows of LCD plates and several serious reversed flows are found inside the utility air plenum and the LCD drying region. Afterwards, several modifications are imposed to assure the uniform velocity distribution at the exit of utility air chamber and the inlet side of LCD substrates. These improvements includes the removal of ventilation opening, the elimination of improper barriers at fan exit, the location adjustment of fan, adjusting the straightener’s porous ratio, additions of the flow straighteners, the blockage plates, and the corner guiding plates. Trough a systematic and comprehensive CFD analysis, it is demonstrated that a slight airstream increase 3.9%, the uniform velocity distribution, and the substantial reductions on the reversed and circulated flow patterns are achieved successfully. Also, the corresponding influences on the parameters are discussed and summarized for the designer’s reference.
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