Molecular Dynamics Simulation on Nanogroove Cutting and Mirror Cutting of Single Crystal Copper

• Main Authors: YU-CHANG SHIU, 許祐彰
• Other Authors: Yuan-Ching Lin
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/74693109819720037273

碩士 === 國立臺灣科技大學 === 機械工程系 === 97 === This study analyzes nano cutting on single crystal copper with diamond tool by molecular dynamics. The interactions between Cu atoms in the workpiece are described by embedded-atom method(EAM) potential and interactions between Cu atoms and C atoms are described by two body potential. On different plane and different direction of groove cutting, analyze the effect on the shape of groove edge in various cutting condition. In high cutting speed, analyze the main mechanism on nanometric mirror cutting. The simulation results show that when the cutting direction is along [-100] direction on (001) plane, the groove edge shows sawtooth and surface on non-cutting place was raised. As the cutting direction is along [-101] direction on (101) plane, the main slip system are (111) plane and (-11-1) plane, if using cutting tool which tool edge is 120 degree, the groove edge of included angle will be ideal 120 degree. The cutting direction is along the [0-10] direction on the (101) plane can cut vertical groove edge, and the cutting force is smaller than other cutting conditions. In nano cutting process, it can use high cutting speed to complete the ideal workpiece surface. Simulation results show that nano mirror cutting speed range from about 400m/s to 500m/s. Too high or too small cutting speed unable to cut the ideal workpiece surface.