Research on Abrasive Free Electrochemical Mechanical Polishing (AF-ECMP) Process of Copper Film
碩士 === 國立臺灣科技大學 === 機械工程系 === 97 === Chemical mechanical planarization (CMP) process is an important technology to achieve overall planarization in integrated circuit (IC) fabrication process. However, there are some problems including residual stress, scratch and post CMP-cleaning in the manufactur...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/62857437638010261147 |