| Summary: | 碩士 === 國立臺灣大學 === 應用力學研究所 === 97 === With continuous progress of semiconductor technology not only are the total heat fluxes of electronic devices increasing, but also are the heat flux distribution highly non-uniform over the die area. The local area of high heat flux which referred to as so called a hot spot adversely affect the reliability, performance and yield of an electronic device.
In this study, a novel closed-loop water system by using micro- pumps was successfully developed by MEMS technique. The working fluid was driven by two valveless micropumps to transport heat from hot spot to other locations of the device and enhance heat-spreading. As a result, the temperature distribution of the chip surface became more uniform. Five geometric designs of the closed-loop water system were used. The flow rates at various driving voltages and frequencies were measured by Micro-PIV technique. A maximum flow rate of 91.4 μl/min was observed at driving voltage of 40 V and frequency of 0.9 kHz. The results also demonstrated the device had an ability to enhance heat-spreading of an electronic device
In summary, the advantages of the present closed-loop water system are easy fabrication and high integration ability. The fabrication processes could be integrated with other electronic devices. In the future, the present system has the potential to integrate with the other electronic devices and increases their reliability.
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