Study on Wear Mechanism of Diamond Dresser
碩士 === 國立臺灣大學 === 機械工程學研究所 === 97 === Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. Due to the dual actions of chemicals corrosion and abrasive abrasion in the slurry, CMP achieves the effect of global planarization on the thin film...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54196199112206552893 |