The Effects on SI and EMI for Differential Coupled Microstrip Lines over LPC-EBG Power/Ground Planes

• Main Authors: Cheng-Hung Shih, 施政宏
• Other Authors: Tzong-Lin Wu
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/00672638424091659181

碩士 === 國立臺灣大學 === 電信工程學研究所 === 97 === Adding decoupling capacitors between the power and ground planes is a typical way to suppress the ground bounce noise(GBN). However, they are not effective at the higher frequency than GHz due to their inherent lead inductance. In recent, a new method for eliminating the GBN at higher frequency is proposed by electromagnetic bandgap structure. To make use of period structure main of EBG, it produces the stopband to suppress the noise. But the reference plane of period structure is not a solid plane, it produces problems on Signal Integrity (SI) and Electromagnetic Compatibility (EMC) because of the slot of the plane. The differential signals have ability on producing low noise and suppressing common noise. In this paper, we discuss the influence of differential coupling coefficient and appropriate layout to design differential signals. Accomplish the purpose of eliminating the GBN at higher frequency, and reduce the Signal Integrity and Electromagnetic Compatibility from the slot of LPC-EBG structure.