Study on the heat-resistance of polyimide/copper composite materials
碩士 === 國立臺南大學 === 系統工程研究所產碩專班 === 97 === Nano-technology is blooming in the past decade, and the polyimide is widely used in the electronic, electrical, and automotive industry, due to its high heat-resistance capability. The two-layer double size FCCL composite material combines polyimide and coppe...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52468438329891224009 |