Novel Anti-Fuse with Step Gox Structure for Nano CMOS Logic Technology Application
碩士 === 國立清華大學 === 電子工程研究所 === 97 === In this study, a novel logic One-Time-Programmable (OTP) cell using Step Gate Oxide of Anti-Fuse (SGAF) with fast programming was demonstrated by nano-meter CMOS logic processes for advance logic NVM’s applications. The silicon data has proven that this cell can...
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ndltd-TW-097NTHU54280182015-11-20T04:19:10Z http://ndltd.ncl.edu.tw/handle/54286077404663517397 Novel Anti-Fuse with Step Gox Structure for Nano CMOS Logic Technology Application 新穎梯形閘極氧化層反熔絲記憶元件應用於奈米製程技術 Wu, Tai-Yi 吳泰億 碩士 國立清華大學 電子工程研究所 97 In this study, a novel logic One-Time-Programmable (OTP) cell using Step Gate Oxide of Anti-Fuse (SGAF) with fast programming was demonstrated by nano-meter CMOS logic processes for advance logic NVM’s applications. The silicon data has proven that this cell can be adapted in both 90nm & 65nm technology nodes. The SGAF cell features complete compatibility to logic process without any additional change in process or mask layers. Gate oxide rupture is used as programming mechanism for the SGAF memory cell. The unique design in this cell is creating a oxide thickness difference in this step gate oxide formation. This cell can be programmed under 4V within 10us, while this low programming voltage can greatly reduce the power consumption as well as complexity in the peripheral circuits. As the breakdown of gate oxide is used as the programming method in SGAF array memory cell, this device is expected to scale better in advance technologies. King, Ya-Chin Lin, Chrong-Jung 金雅琴 林崇榮 2009 學位論文 ; thesis 84 zh-TW |
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碩士 === 國立清華大學 === 電子工程研究所 === 97 === In this study, a novel logic One-Time-Programmable (OTP) cell using Step Gate Oxide of Anti-Fuse (SGAF) with fast programming was demonstrated by nano-meter CMOS logic processes for advance logic NVM’s applications. The silicon data has proven that this cell can be adapted in both 90nm & 65nm technology nodes. The SGAF cell features complete compatibility to logic process without any
additional change in process or mask layers. Gate oxide rupture is used as programming mechanism for the SGAF memory cell. The unique design in this cell is creating a oxide thickness difference in this step gate oxide formation. This cell can be programmed under 4V within 10us, while this low programming voltage can greatly
reduce the power consumption as well as complexity in the peripheral circuits.
As the breakdown of gate oxide is used as the programming method in SGAF array memory cell, this device is expected to scale better in advance technologies.
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author2 |
King, Ya-Chin |
author_facet |
King, Ya-Chin Wu, Tai-Yi 吳泰億 |
author |
Wu, Tai-Yi 吳泰億 |
spellingShingle |
Wu, Tai-Yi 吳泰億 Novel Anti-Fuse with Step Gox Structure for Nano CMOS Logic Technology Application |
author_sort |
Wu, Tai-Yi |
title |
Novel Anti-Fuse with Step Gox Structure for Nano CMOS Logic Technology Application |
title_short |
Novel Anti-Fuse with Step Gox Structure for Nano CMOS Logic Technology Application |
title_full |
Novel Anti-Fuse with Step Gox Structure for Nano CMOS Logic Technology Application |
title_fullStr |
Novel Anti-Fuse with Step Gox Structure for Nano CMOS Logic Technology Application |
title_full_unstemmed |
Novel Anti-Fuse with Step Gox Structure for Nano CMOS Logic Technology Application |
title_sort |
novel anti-fuse with step gox structure for nano cmos logic technology application |
publishDate |
2009 |
url |
http://ndltd.ncl.edu.tw/handle/54286077404663517397 |
work_keys_str_mv |
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