| Summary: | 碩士 === 國立清華大學 === 資訊工程學系 === 97 === Wire bonding is the most popular method to connect signals between dies in System-
in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to
die pads so as to facilitate wire bonding, is an important physical design problem for
SiP design because the quality of a pad assignment solution aects both the cost and
performance of a SiP design. In this thesis, we study a pad assignment problem, which
prohibits the generation of illegal crossings and aims to minimize the total signal wire-
length, for die-stacking SiP design. We rst consider a variety of special cases and present
a minimum-cost maximum-
ow based approach to optimally solve them in polynomial
time. We then describe an approach, which uses a modied left edge algorithm and an
integer linear programming technique, to solve the general case. Encouraging experimen-
tal results are shown to support our approaches. To the best of our knowledge, our work
is the rst one which addresses a pad assignment problem for die-stacking SiP design and
gives promising solutions.
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