Design, Structural Reliability Assessment, and Electromigration Evaluation for the Advanced Microelectronic Packages
博士 === 國立清華大學 === 動力機械工程學系 === 97 === In this research, the improvements and design concepts of advanced wafer level package (WLP) are studied. Two major targets, the solder joint stress release and the integrated circuit (IC) signal fan-out, are especially focused. Due to the demands of the suitabl...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53230705966262107534 |