The joint study of BGA solder ball on the OSP type substrate

The joint study of BGA solder ball on the OSP type substrate

碩士 === 國立中山大學 === 材料與光電科學學系研究所 === 97 === none

Bibliographic Details
Main Authors:	Kuan-ting Lin, 林冠廷
Other Authors:	Ker-chang Hsieh
Format:	Others
Language:	zh-TW
Published:	2009
Online Access:	http://ndltd.ncl.edu.tw/handle/rrbc82

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