The joint study of BGA solder ball on the OSP type substrate

碩士 === 國立中山大學 === 材料與光電科學學系研究所 === 97 === none

Bibliographic Details
Main Authors: Kuan-ting Lin, 林冠廷
Other Authors: Ker-chang Hsieh
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/rrbc82