Multi-objective Optimization of Wire-bonding process for Light Emitting Diode Package

碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 97 === Abstract In terms of majority contributions of semiconductor industries in Taiwan, contract electronics manufacturers (CEM) are becoming significant roles and managing competitions among them. It is critical and essential to establish mechanisms of control...

Full description

Bibliographic Details
Main Authors: jr iuan, 陳志元
Other Authors: Yih - Fong Tzeng
Format: Others
Language:zh-TW
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/20407650545076344527

Similar Items