Multi-objective Optimization of Wire-bonding process for Light Emitting Diode Package

• Main Authors: jr iuan, 陳志元
• Other Authors: Yih - Fong Tzeng
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/20407650545076344527

碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 97 === Abstract In terms of majority contributions of semiconductor industries in Taiwan, contract electronics manufacturers (CEM) are becoming significant roles and managing competitions among them. It is critical and essential to establish mechanisms of controlling quality to evaluate yields and reducing production capitals. Therefore, each stage and process in manufacturing processes reveals rather influential. The purpose of the research is to experiment with wire bonding in IC package and attempt to determine the optimal parameters by applying Taguchi method. That is, in particular, the effects on primary parameters and their interactions of welding within the ultrasonic process are what this research achieved. Simultaneously, the experiment concentrates on observations of four outstanding factors which are the shear strength, the tensile force, the cross-section test, and welding points. The optimum argument combinations can be developed against the regression and analysis of Taguchi method. Besides, a three-dimensional microscope is used to learn variations of welding points in microcosmic organizations through different arguments. It is extremely expect to enhance achievement in ultrasonic wire bonders. In sum, the research is aim to explore the welding mechanism which is based on the diverse parameters within progress of performing theorem thoroughly. Otherwise, creating and referencing a line graph of loading versus time, finding interactions in different argument combinations of ultrasonic welding processes out by Taguchi method, and promoting ultrasonic wire bonding are the principles of this dissertation.