Building Vertical Conductive Channels by Micro-Bead Self-Assembly

• Main Authors: Chich-Hung Cheng, 鄭至紘
• Other Authors: Kerwin Wang
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/02053037260345453878

碩士 === 國立彰化師範大學 === 機電工程學系 === 97 === In recent years, the portable consumer electronic products are getting smaller and smaller. To increase the operating speed and the capability of a miniaturized multifunctional system, one would need to integrate different chips into one densely packaged component. One good solution is 3D flip-chip packaging. This paper presents experimental and simulation based studies for micro conductive beads assembly in flip-chip packaging. The influence of bonding site and solder ball dimension to the assembly repeatability are investigated by experiment and simulation methods. The thesis also proposed two image recognition algorithms for bead counting.