Research of Transmitting Part for Compact and Passive-Alignment 4-channel × 2.5 Gbps Optical Interconnect Module

• Main Authors: Chia-Yu Lee, 李佳祐
• Other Authors: Mount-Learn Wu
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/43273014418012351981

碩士 === 國立中央大學 === 光電科學研究所 === 97 === In this thesis, an optical interconnect technology serving as a board to board interconnect is realized by assembling active and passive optical devices on a silicon-optical bench (SiOB). The transmitter module based on SiOB includes a monolithic integration of silicon-based 45° micro-reflector, V-groove arrays, high-frequency transmission lines of 2.5 GHz, and bonding pads with Au/Sn eutectic solder, as well as hybrid integration of VCSEL and fiber ribbon with compatibility to high precise passive alignment process. The size of transmitter module can be only 1 × 1 cm2 for the 4-channel interconnect. The depth of 45° micro-reflector reaches to 110 μm for providing -6 dB coupling efficiency from Vertical-Cavity Surface-Emitting Laser (VCSEL) to multi-mode fiber (MMF). Utilizing micro lithography and flip chip bonding processes, the process tolerance and VCSEL bonding accuracy are within 6 % and 2 μm, respectively, making sure the optical alignment tolerance within 20 μm and only 1 dB power variation. The performance of transmission lines of 2.5 GHz is experimentally demonstrated. The eye pattern was measured at circuit source 6 mA for 2.5Gbps PN-signal (15 bit).