| Summary: | 碩士 === 國立中央大學 === 環境工程研究所 === 97 === Perfluorinated compounds (PFCs) are widely used in semiconductor industry for chemical vapor deposition (CVD) and dry etching. PFCs have strong apacities on infrared rays absorption, they will aggravate global warming once emitted into the atmosphere. Among the diverse strategies for PFCs removal, the abatement techniques is still the most available one. Combustion and catalytic oxidation are commonly used approaches for reducing PFC emissions. However, relatively high fuel cost and potential poisoning of catalyst limit their further application. This study investigates the effectiveness of plasma combined with adsorbent for C3F8 removal. The experimental results indicate Bead-shape activated carbon has the best adsorption capacity, the reason supposed to be the oxygen functional groups at adsorbent surface would affect the adsorption capacity of C3F8. Adsorbent after plasma treatment will decrease BET surface area and increase average pore diameter, and the amount of oxygen functional groups at surface increase as well. The removal efficiency of C3F8 increased with application of oxygen content. However, removal efficiency of C3F8 was found to decrease if more than 2% of oxygen was applied. The removal efficiency and product selectivity of C3F8 achieved with plasma combined with adsorbent were significantly higher than those without adsorbent of might result from the fact that adorbent can extend the retention time of C3F8. Experimental results indicate that plasma combined with adsorbent for C3F8 removal was technically feasible.
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