Electrical Simulation and Current Spreading Analysis in the GaN-based Light-Emitting Diode Devices
博士 === 國立中央大學 === 機械工程研究所 === 97 === When the chip size of light emitting diodes (LEDs) and the input power become larger, current spreading in the active layer will obviously affect the optical, electrical, and thermal packaging performances of the LED chip. To further understand the current sprea...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22130818217450274401 |