Assembly of Three Dimensional Microstructures with Multiple Angles by One-Push Method on SOI Wafers
碩士 === 國立交通大學 === 電機與控制工程系所 === 97 === Recently, the Micro Electro Mechanical Systems (MEMS) technology has many important developments with the rapid progress in the semiconductor industry. Many applications demand three-dimensional (3-D) structures. Especially in optics, the angular accuracy of th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18528294161777747953 |