| Summary: | 碩士 === 國立交通大學 === 電子工程系所 === 97 === In this thesis, process optimization of electroplated Cu-Ni nanocomposite has been developed for the fabrication of low power magnetic microactuators. Experimental results show the concentration of embedded Ni nanopowders in Cu matrix will depend on the size of device structure and the concentration of Ni powders in electroplating bath. Three different concentrations of 100nm Ni in Cu based electroplating solutions, which are 2, 5 and 8.5 g/L, are prepared for line structural plating in which the widths of the line pattern are designed with 10, 50, 200, and 500μm, respectively. DC conductivity and superconducting quantum interference device (SQUID) measurements show that the Cu-Ni composite line with the width of 200μm plated in the bath of 2g/L Ni powders exhibits best power saving characteristics. By applying the optimized process condition to the fabrication of inductive microcoil for microactuation, the nanocomposite coil can have about 20% power saving in comparison with that made of copper-made actuator.
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