The application of a new dispatching rule and simulation in solving the multiple criteria decision-making of due date oriented problem for IC packaging manufacturing
碩士 === 國立成功大學 === 製造工程研究所碩博士班 === 97 === In the era of the knowledge economy, the application of the electronic products is becoming more extensive. With the shortening of products life cycle and diversification of customer’s demand, IC packaging industry must promote the technological ability of pa...
Main Authors: | Hsin-yi Wang, 王馨儀 |
---|---|
Other Authors: | Taho Yang |
Format: | Others |
Language: | zh-TW |
Published: |
2009
|
Online Access: | http://ndltd.ncl.edu.tw/handle/76569817916183775314 |
Similar Items
-
The use of statistical throughput control and discrete-event simulation in solving the dispatching problem of an IC packaging manufacturing-nominal the best of due date
by: Ying-Shiou Chen, et al.
Published: (2007) -
Dispatching Rules for Possibly Delayed Lots In an IC Foundry
by: Wen-Yang Tseng, et al.
Published: (2002) -
Studying the Short Cycle Time and the Model of the Due Date Control for IC Packaging Factory
by: Hsu, Chien-Dai, et al.
Published: (1998) -
Two-Stage Stochastic Programming to Solve the Capacity Allocation Problem of IC-Packaging Manufacturing
by: Da-Wei Ciou, et al.
Published: (2015) -
A method for constructing multi-criteria dispatching rules
by: Chen;Shyh Wen, et al.
Published: (1993)