POP IC Package Warpage Analysis
碩士 === 國立成功大學 === 機械工程學系專班 === 97 === In IC assembly manufacturing, the IC package would be heated for completing final SMT process. It would causes warpage problem if it remaining strain or stress in inside of package. For IC package, the remaining stress and strain would make warpage become worse...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73196896642703200274 |