| Summary: | 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 97 === The aim of this paper is to study interface adhesion properties and release residual stresses via nanoindentation experiments. In the first part, glow discharge spectrometer(GDS)、Raman spectrum、focus ion beam and nanoindentation is used to detected Diamond-like-carbon mechanism properties deposited by high power impulse magnetron sputtering(HIPIMS). By using GDS thin film composition analysis to detect carbon sputtering depth, the thin thickness and overlap layer thickness can be known. By using focus ion beam, the carbon depth can be measure specific and the thin film’s smoothness and tightness can be known. Through the Raman spectrum analysis, the ratio of sp3 and sp2 in diamond-like-carbon can be measure. The ratio is to check that whether thin film composition is near diamond’s composition. The nanoindentation test is to measure mechanical properties of thin film. The results, film thickness, of two experiments, which are GDS and FIB are close. Also the thickness and surface smoothness are good.
In the part of estimation of thin film’s adhesion property, cyclic dynamic loading nanoindentation test forces the pop-in phenomenon which happens on thin film. After delamination the force-depth curve may have phase lag phenomenon. By removing the phase lag force-depth curve, the adhesion property of thin film can be measure. As the result shows, the strain energy release rate of thin film is high. The test may not delaminate without cyclic dynamic loading and using sharp indenter.
In the of residual stress release analysis, using nanoindentation test and cyclic dynamic loading, the thin film delaminates. When the thin film delaminates the residual stress in thin film may release. The residual stress can be calculated by the linear behavior of force-depth curve. Whether the difference frequency of cyclic dynamic loading may cause different residual stress of thin film is negative. Then by using cyclic dynamic loading, the buckle behavior and strain energy release rate can be analyzed by indentation stress and residual stress. According to the results, the residual depth may come back to the initial indenting point when the buckling of thin film happens. Also, the strain energy release rate may be higher when the buckling of thin film happens than when the buckling of thin film does not happen.
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