Optimization of the Zn and Bi content on Lead-Free Sn-Zn-Bi Alloys
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === The lead-free stannum system is mainly applied in the electronic packaging industry. The ductility is decreased when the excessive Zn and Bi content is assed in the Sn-Zn binary alloys, and low ductility is detrimental to the electronic seal industry. The i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03142995025926974065 |