Characterization of the Cross-section Microstructure of Pulse Electroplaing Cu
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === The performance of aluminum interconnection in chips was not enough because of those electronics products getting thinner and smaller. The efficiency and development will be limited through interconnections. when the size of aluminum inter connects are sma...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81165098895496457626 |