The study of preparation and properties of lightweight and thermal conducting Cu/Al composites

• Main Authors: Tsung-Tse Chiang, 江宗澤
• Other Authors: Chi-Yuan Tsao
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/66565282428632076586

碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 97 === Aluminum base-metal matrix composite became more popular in thermo management materials over the past few years，because it had the advantage of weight. In this research，we prepared the aluminum powder with copper coated via electrolessplating technique. Cu/Al composites of five different contents will be fabricated by P/M method. Besides to realize the effects of electrolessplating in composites，we used pure Cu and Al powders to make the former composites in the same Cu/Al ratio .Hot press and spark plasma sintering (SPS) were both applied to make the composites. The best parameters of pre-copper elelctrolessplating and copper elelctrolessplating were discussed in this research，and the aluminum powders with fine copper coated，65~75μm in diameter，12.5Cu vol%，were successfully made. The composites would have the several IMC structures like CuAl2、Cu9Al4 ，when temperature over 400℃ by hot pressing process. But them made by SPS process in 400℃/100MPa had invisible IMC structures，and the density of theoretical were over 98%. With the increase of copper content，the thermal conductivity，micro-hardness and compression yield strength would get raise，and the density of theoretical，coefficient of thermal expansion would be a little decreased. Finally，it would be helping of increasing the thermal and mechanical properties of the composites via the method of elelctrolessplating on surface of the powders .