A Study on the Process Equipment Maintenance for Semiconductor Foundry by FMEA Approach

• Main Authors: Hung-Yi Chen, 陳鴻儀
• Other Authors: Tse-Sheng Chen
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/68537838841394826532

碩士 === 國立成功大學 === 工學院工程管理專班 === 97 === The FMEA (Failure Mode and Effect Analysis) approach is usually used to analyze the potential failure mode of a system and to propose the proper improvement action for preventing the occurrence of specified failure. It is one of the key technology for the 12" semiconductor foundry in systematic engineering management. We can apply it to develop the efficiency and enhance the stability for the process equipments. Meanwhile, we can also use it to reduce the impact of failure and control the production loss as well. We try to apply the FMEA technology to set up a model for the process equipment with high risk to accumulate the engineering knowledge and provide the effective solution. An improvement mechanism has been set up to develop the risk and stability management. The major goal is to prevent and control some important failure factors. Thus, the scope of failure mode can be reduced and the productivity can be enhanced. Finally, the product yield as well as the business competition advantage will be increased. A suitable methodology of stability improvement for the semiconductor foundry process equipment is introduced by the FMEA approach in this study. Some key factor's data are collected and analyzed from the case wafer semiconductor foundry main production line. The result information will provide a better reference technology for improving the process equipment maintenance. It also help the technicians to continue their further studies.